韩国三级在线观看,日产学生妹在线观看,无码国产精品一区二区免费vr,人妻被按摩师玩弄到潮喷

Contact Us???
Your Position: Home > News > Company News

In May 8, 2012, promote the use of TSV ( TSV ) 3D laminated to a

2012/8/16??????view:

  In May 8, 2012, promote the use of TSV ( TSV ) 3D laminated to a new generation of DRAM " Hybrid Memory Cube ( HMC ) Hybrid Memory Cube Consortium " popularity ( HMCC ) announced that the United States, software giant Microsoft has joined the association.

  HMC is the three-dimensional structure, the logic chip along the vertical direction superposition of multiple DRAM chips, and then through the TSV connection wiring technology. HMC 's biggest characteristic is compared with existing DRAM, performance can be greatly improved. The reasons there are two, one is between chips from semiconductor package wiring distance on a board on the traditional methods of " cm " units are substantially reduced to dozens ofμ m~ 1mm; two is on a chip to form 1000 to tens of thousands of TSV, realize the multipoint connection chip.

  Microsoft 's accession to the HMCC, because we are considering how to corresponding is likely to become a personal computer and a computer to improving the performance of " memory bottleneck " problem. Memory bottleneck refers to as the microprocessor performance through multiple nucleation and constantly improve, the architecture of the DRAM performance will not be able to meet the need of processor. If do not solve this problem, can occur even if the computer new product, the actual performance is also not appropriate promotion situation. Compared with it, if the TSV based on the application of HMC in computer main memory, the data transmission speed can be increased to the current DRAM is about 15 times, therefore, is not just a giant Microsoft, American companies such as Intel are also active in research using HMC.

  In fact, plans to use TSV not only for HMC and other DRAM products. According to the semiconductor manufacturers plan, in the next few years, borne from electronic equipment input function of the CMOS sensor to the responsible for the operations of FPGA and multi core processor, and in charge of product storage of DRAM and NAND flash will have to import TSV. If the plan goes ahead, TSV will assume the input, operation, storage and other electronic equipment main function.

  In May 8, 2012, promote the use of TSV ( TSV ) 3D laminated to a new generation of DRAM " Hybrid Memory Cube ( HMC ) Hybrid Memory Cube Consortium " popularity ( HMCC ) announced that the United States, software giant Microsoft has joined the association.

  HMC is the three-dimensional structure, the logic chip along the vertical direction superposition of multiple DRAM chips, and then through the TSV connection wiring technology. HMC 's biggest characteristic is compared with existing DRAM, performance can be greatly improved. The reasons there are two, one is between chips from semiconductor package wiring distance on a board on the traditional methods of " cm " units are substantially reduced to dozens ofμ m~ 1mm; two is on a chip to form 1000 to tens of thousands of TSV, realize the multipoint connection chip.

  Microsoft 's accession to the HMCC, because we are considering how to corresponding is likely to become a personal computer and a computer to improving the performance of " memory bottleneck " problem. Memory bottleneck refers to as the microprocessor performance through multiple nucleation and constantly improve, the architecture of the DRAM performance will not be able to meet the need of processor. If do not solve this problem, can occur even if the computer new product, the actual performance is also not appropriate promotion situation. Compared with it, if the TSV based on the application of HMC in computer main memory, the data transmission speed can be increased to the current DRAM is about 15 times, therefore, is not just a giant Microsoft, American companies such as Intel are also active in research using HMC.

  In fact, plans to use TSV not only for HMC and other DRAM products. According to the semiconductor manufacturers plan, in the next few years, borne from electronic equipment input function of the CMOS sensor to the responsible for the operations of FPGA and multi core processor, and in charge of product storage of DRAM and NAND flash will have to import TSV. If the plan goes ahead, TSV will assume the input, operation, storage and other electronic equipment main function.

久久精品国产一区二区电影 | 伊人久久久精品区aaa片| 久久夜色撩人精品国产av| 久久性爱视频| 同性男男黄g片免费网站| 熟女少妇内射日韩亚洲| 国产精品看高国产精品不卡| 少妇下面好紧好多水真爽播放| 亚洲av日韩av无码a一区| 国产精品后入内射日本在线观看| 亚洲av人无码激艳猛片| 性色av闺蜜一区二区三区| 精品国产第一国产综合精品| av无码人妻一区二区三区牛牛| 韩国19禁无遮挡啪啪无码网站| 久久久精品免费| 在线视频夫妻内射| 亚洲欧洲无码一区二区三区| 97无码免费人妻超级碰碰夜夜| 精品亚洲成av人在线观看| 性人久久网av| 四十如虎的丰满熟妇啪啪 | 无遮挡粉嫩小泬久久久久久久| 夜夜添无码试看一区二区三区| 中文亚洲欧美日韩无线码| 亚洲av第一成肉网| 加勒比一本heyzo高清视频| 亚洲欧美日韩一区在线观看| 欧美综合天天夜夜久久| 精品久久久久中文字幕日本| 国产精品主播一区二区三区| 色妺妺视频网| 色欲人妻aaaaaa无码| 国产免费一区二区视频| 侵犯人妻教师波多野吉衣 | 国产精品久久久久一区二区三区 | 一本色道久久99一综合| 精选国产av精选一区二区三区| 欧洲无码一区二区三区在线观看| av中文无码乱人伦在线观看| 亚洲经典千人经典日产|